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La norme ATX prévoit des dimensions de 305 × 244 mm, tandis que la spécification SSI EEB autorise une taille maximale de carte mère de 305 × 330 mm.
“La mention ” E-ATX » figurant sur la fiche technique d'une carte mère ne garantit pas une largeur fixe de la carte ni une compatibilité certaine avec un châssis donné.
Deux cartes vendues sous la référence E-ATX peuvent présenter une différence de profondeur supérieure à 50 mm.
Le fait qu'une carte mère s'insère dans le boîtier ne garantit pas que ses entretoises, ses passages de câbles, l'espace disponible pour les barrettes DIMM, la disposition des emplacements PCIe ou ses connecteurs d'alimentation seront compatibles.
Pour les projets OEM, de stations de travail, industriels et de serveurs, la vérification de compatibilité la plus fiable repose sur le modèle exact de la carte mère et le plan d'assemblage, et non pas uniquement sur la désignation du format.
La compatibilité des cartes mères semble simple, jusqu'à ce qu'on doive monter le système.
ATX. E-ATX. SSI-EEB.
Trois étiquettes. Trois cases à cocher sur une fiche technique. Facile, non ?
Pas vraiment.
Dans le cadre de l'assemblage d'un PC grand public, une erreur de ce type peut entraîner le retour du boîtier. Pour un intégrateur système commandant 200 châssis, un fabricant d’ordinateurs industriels gelant une nomenclature de production, ou un équipementier expédiant des serveurs à l’international, la même erreur peut entraîner la création de nouveaux outillages de tôlerie, la modification des supports de carte mère, le blocage des chemins de câbles, des retards d’assemblage et une discussion très délicate avec le service des achats.
C'est pourquoi Compatibilité des formats de carte mère Il faut aborder cette question sous l'angle de l'ingénierie mécanique plutôt que sous celui du marketing ou de l'étiquetage.
Et cela n'est nulle part plus évident que dans le cas de E-ATX vs SSI-EEB.
ATX nous offre un point de départ fiable
L'ATX, c'est le plus simple.
La spécification « Enterprise Electronics Bay » du SSI Forum définit une carte mère ATX comme suit : 305 × 244 mm, soit 12 × 9,6 pouces. Ce même document de la SSI explique que la conception de l'EEB est issue de l'ATX.
Cette configuration ATX normalisée offre aux ingénieurs spécialisés dans les châssis un point de départ raisonnablement prévisible pour :
contours de la planche
position des ports d'E/S à l'arrière
Relation entre les emplacements PCIe
conception du plateau de la carte mère
emplacements de montage standard
C'est précisément grâce à cette prévisibilité que la prise en charge d'ATX est relativement simple à expliquer.
Dès que le plateau s'élargit, ça devient vite compliqué.
Si vous êtes déjà en train de comparer ATX vs E-ATX Dans le cadre d'une décision plus large concernant l'architecture en montage en rack, il ne faut pas isoler la carte mère du reste du système. La hauteur du rack, les cartes d'extension, le refroidissement, l'alimentation, les baies de disques et l'acheminement des câbles se disputent tous le même volume interne.
Comparaison des formats ATX, E-ATX et SSI-EEB
Format / Étiquette
Dimensions publiées
Largeur supérieure à celle de l'ATX
Ce que les acheteurs doivent surveiller
ATX
305 × 244 mm
Base de référence
Généralement prévisible dans les boîtiers ATX standard
Schéma de montage, largeur du plateau, barrettes DIMM, câbles d'alimentation
Exemple de serveur GIGABYTE E-ATX
305 × 330 mm
+86 mm
Ne partez pas du principe que les boîtiers E-ATX grand public prennent en charge cette fonctionnalité
Le premier chiffre ne pose pas de problème.
Le deuxième, c'est….
That extra motherboard depth pushes the board edge farther into the chassis, exactly where designers often place cable cutouts, drive cages, side fans, fan walls, front-access connectors, cable covers, or reinforcement structures.
A motherboard can therefore be technically “inside the box” and still be unusable.
Why E-ATX Is the Label I Trust the Least
Here is where the industry creates its own confusion.
ASUS currently lists its ROG Maximus Z890 Extreme as an E-ATX motherboard measuring 12 × 10.9 inches, or 30.5 × 27.7 cm on the official ASUS specifications page.
Now look at a server board.
GIGABYTE lists the MZ33-AR0 as E-ATX, but its official specification gives a size of 305 × 330 mm. That board supports AMD EPYC processors, 24 DIMM slots, and four PCIe Gen5 x16 expansion slots.
Same E-ATX label.
ASUS: 277 mm deep.
GIGABYTE: 330 mm deep.
That is a 53 mm difference.
Fifty-three millimeters is not a rounding error in chassis engineering. It can be the entire cable-management channel.
C'est pour cette raison que E-ATX Case Compatibility should never be reduced to a yes/no field in a purchasing spreadsheet. When reviewing E-ATX Case Compatibility for an actual project, ask for the maximum supported board dimensions and the tray drawing.
“Supports E-ATX” is only the beginning of the conversation.
What Exactly Is SSI-EEB?
SSI-EEB comes from the Server System Infrastructure Forum’s Enterprise Electronics Bay specification for servers and workstations.
The specification describes the EEB baseboard as an ATX-derived design stretched to a maximum 305 × 330 mm, or 12 × 13 inches. Interestingly, the document itself notes that this size is sometimes called “extended ATX” or “full ATX.”
There is your naming problem.
A 12 × 13-inch server board may be described in one context as SSI-EEB and in another as E-ATX.
But matching outer dimensions still do not settle the installation question.
When evaluating a SSI-EEB Motherboard for an industrial or server platform, the chassis needs enough board area, but it also needs the correct support structure around that board.
The label tells you the neighborhood.
It does not give you the house number.
The Mounting-Hole Problem Buyers Discover Too Late
This is the part that causes real-world pain.
The SSI specification explicitly states that a compliant baseboard is not required to use every available mounting location. It also defines alternative mounting positions where legacy locations cannot be used.
For rack-mounted designs, the standard says board and chassis developers may need to communicate about which mounting locations will actually be used because implementing removable standoffs can be difficult. The chassis requirements also warn that fixed, non-removable attachment points can create interference problems.
That is not a minor detail.
Imagine approving 100 rackmount enclosures because the specification says “12 × 13 motherboard support.”
The boards arrive.
The PCB fits.
Then assembly discovers that several support points do not align.
Now what?
Drill the tray manually? Add press-in standoffs? Create an adapter plate? Rework finished chassis? Leave unsupported board sections floating?
None of those are attractive production options.
For serious SSI-EEB Case Compatibility work, we prefer to validate the actual board drawing during the engineering stage. That is far safer than discovering the mounting pattern after painted production chassis are sitting on the assembly floor.
I Saw Exactly This Failure in the Wild
Recently, I was browsing an r/buildapc discussion and came across a builder using a Supermicro X11DPH-T avec un Lian Li Odyssey X.
On paper, the match looked difficult to mess up.
The builder described the motherboard as E-ATX/SSI-EEB and said the case supposedly supported that type of board.
That story sticks with me because it captures the mistake perfectly.
The buyer checked the category.
He did not validate the interface.
The motherboard could enter the chassis. That did not mean the chassis properly supported the motherboard.
As a chassis supplier, this is why I never want a project brief that says only:
“Motherboard: E-ATX.”
Send the model number.
Better yet, send the PDF drawing.
My Unpopular View: “E-ATX Compatible” Is Not a Professional Specification
Voici la position que j'adopte vis-à-vis des acheteurs :
“E-ATX compatible” is not enough information to approve a production chassis.
That may sound overly strict.
Ce n'est pas le cas.
Current manufacturer specifications already show that boards carrying the E-ATX name can have dramatically different dimensions. Add mounting locations, cable exits, power connectors, DIMM latches, PCIe slots, risers, fan walls, drive cages, and service access, and the label starts telling you surprisingly little about the completed assembly.
For a one-off gaming PC, people improvise.
For a workstation, industrial computer, GPU server, storage appliance, or product that must ship repeatedly under a controlled BOM, improvisation is bad production engineering.
The question should not be:
Does this chassis support E-ATX?
The better question is:
Does this chassis support this exact motherboard, with this exact mounting pattern, connectors, expansion cards, cabling, cooling hardware, and service envelope?
That small change in wording prevents a lot of expensive mistakes.
Physical Fit Is Only Layer One
Even after the mounting holes match, we are not finished.
A complete compatibility review should check several mechanical zones.
1. Right-Edge Connector Access
As boards become deeper, their right edge can move directly over cable openings or sheet-metal structures.
Typical problem areas include:
24-pin motherboard power
USB headers
SATA connectors
front-panel headers
fan headers
MCIO or SlimSAS connectors
side-facing power connectors
A connector can be physically present yet impossible to cable after installation.
That still counts as incompatible.
2. DIMM Installation and Removal
Large workstation and server boards may place DIMM sockets close to the outer PCB edge.
The SSI specification specifically discusses clearance near the board edge because DIMM latches may extend beyond the baseboard footprint when opened. Chassis designers therefore need to preserve insertion and extraction room.
This becomes especially annoying during field service.
A server that requires motherboard removal just to replace memory is not designed for pleasant maintenance.
3. PCIe Slot Alignment
Expansion-slot geometry must match the rear chassis openings.
That gets harder when the system uses:
GPU risers
bifurcation boards
horizontal expansion
full-height accelerators
double-width GPUs
NICs or DPUs
storage controllers
A motherboard may mount correctly while the intended expansion architecture does not.
4. CPU and EPS Power Clearance
Server and workstation boards often place CPU power connectors near the upper or forward edge of the PCB.
Now add:
parois du ventilateur
large heatsinks
radiator structures
cable bends
drive backplanes
chassis reinforcement beams
You can lose access quickly.
5. Chassis Depth
Board width and chassis depth are different measurements, but they interact.
A 330 mm motherboard inside a shallow enclosure leaves less room in front of the PCB for fans, storage, backplanes, connectors, and cable bend radius.
C'est pourquoi SSI-EEB Dimensions should be evaluated against the complete internal chassis layout, not only the sheet-metal outer dimensions. The linked 4U platform, for example, is published for motherboards up to the 12 × 13-inch class, but exact component fit still needs project-level confirmation.
Millimeters matter.
Beaucoup.
E-ATX vs SSI-EEB: What Actually Changes for the Chassis Engineer?
From the chassis side, the biggest mistake is assuming that a form-factor label automatically defines every mechanical interface.
It does not.
For each project, we want to verify:
Engineering Check
Pourquoi c'est important
PCB length and depth
Confirms the board physically enters the tray area
Mounting-hole coordinates
Confirms every required standoff can be supported
Rear I/O location
Confirms alignment with the chassis aperture
PCIe slot locations
Confirms card alignment and riser feasibility
DIMM keep-out
Preserves memory installation and service access
Power connector locations
Prevents fan-wall or cable-routing collisions
Cable exit direction
Protects bend radius and serviceability
CPU cooler envelope
Prevents lid, duct, or fan interference
GPU geometry
Confirms slot, length, thickness, and power clearance
Fan and backplane position
Prevents overlap with the front edge of a deep board
This is Compatibilité des formats de carte mère in practical terms.
Not a logo.
An interface map.
The RFQ Should Name the Motherboard
For OEM and ODM projects, motherboard information should be frozen early.
A useful chassis RFQ should provide:
Motherboard manufacturer and exact model Not just ATX or E-ATX.
PCB dimensions Use manufacturer dimensions, preferably in millimeters.
Mechanical drawing Include mounting-hole coordinates when available.
Rear I/O configuration Standard shield, custom opening, fixed ports, or server-specific I/O.
Expansion architecture Direct PCIe cards, risers, GPUs, NICs, storage controllers, or switching boards.
CPU and memory configuration Especially important for high DIMM counts and tall heatsinks.
Power connectors Include connector location and cable exit direction.
Expected production revision A sample motherboard is useful, but revision-controlled drawings are better.
This is also why custom projects should be engineered around the complete component stack. The site’s custom server chassis fabrication process, for example, begins with system components, dimensions, cooling and connector requirements before production drawings are released.
That sequence makes sense.
Freeze the electronics.
Then freeze the metal around them.
Do Not Let Procurement Turn Compatibility Into a Checkbox
Procurement teams love standardized fields.
I understand why.
ATX: yes. E-ATX: yes. SSI-EEB: yes.
Clean spreadsheet.
Dangerous assumption.
For sourcing, those fields should be treated as preliminary filters. Engineering approval should come from the actual motherboard-to-chassis fit review.
A better supplier question would be:
“Please confirm compatibility with motherboard model XYZ-123, drawing revision B, including all required standoffs, rear I/O, PCIe slots, EPS connectors, DIMM service clearance, and cable-routing access.”
That question is harder to answer.
Bien.
Hard questions catch expensive problems while they are still cheap to fix.
A Simple Compatibility Approval Process
Before approving a server or workstation chassis, run the project through this sequence:
Identify the exact motherboard model.
Confirm the published PCB dimensions.
Obtain the mechanical drawing.
Overlay the mounting-hole pattern on the chassis tray.
Confirm rear I/O alignment.
Map PCIe slots and risers.
Check DIMM and cooler keep-out areas.
Check every motherboard power and data connector.
Install planned GPUs and expansion cards in CAD or a physical prototype.
Verify fan walls, backplanes, drive cages, cables, and service access.
Build one production-representative prototype.
Freeze the approved motherboard and chassis drawing revisions together.
Do that, and ATX, E-ATX, and SSI-EEB stop being confusing labels.
They become controlled engineering inputs.
That is where they belong.
FAQ
Le format SSI-EEB est-il identique au format E-ATX ?
Short answer: No. The names can overlap in real product listings, but you should not assume they guarantee identical mechanical compatibility.
The SSI EEB specification defines a maximum 305 × 330 mm baseboard and documented mounting locations. Current manufacturers also use “E-ATX” for boards with different depths, so exact dimensions and mounting patterns must be checked.
Quelles sont les dimensions standard du SSI-EEB ?
Short answer: The SSI EEB specification defines a maximum baseboard size of 305 × 330 mm, or 12 × 13 inches.
Smaller board outlines are possible under the specification. Chassis compatibility still depends on mounting locations, keep-out zones, connector positions, and the rest of the installed hardware.
Quelles sont les dimensions d'une carte mère ATX standard ?
Short answer: Standard ATX measures 305 × 244 mm, or 12 × 9.6 inches.
This smaller and more predictable footprint is why ATX compatibility is generally easier for chassis manufacturers to define than the broader range of products marketed as E-ATX.
Pourquoi certaines cartes mères E-ATX ont-elles des dimensions différentes ?
Short answer: Manufacturers use the E-ATX label on boards with different PCB depths, so the name does not always describe one identical physical envelope.
For example, ASUS publishes a 305 × 277 mm E-ATX board, while GIGABYTE publishes a 305 × 330 mm server board under the same E-ATX label.
Un boîtier E-ATX est-il toujours compatible avec une carte mère SSI-EEB ?
Short answer: No. Physical board space alone does not guarantee SSI-EEB support.
Verify the motherboard dimensions, mounting-hole locations, rear I/O, PCIe alignment, DIMM clearance, power connectors, cable paths, fan structures, and chassis tray before approving the combination.
Une carte mère peut-elle tenir dans un boîtier tout en étant incompatible ?
Short answer: Yes. A board can physically enter the chassis while mounting holes, connectors, expansion slots, or service clearances do not align.
This is one of the most common mistakes when compatibility is judged by outer dimensions alone.
Que dois-je envoyer à un fournisseur de châssis pour vérifier la compatibilité de la carte mère ?
Short answer: Send the exact motherboard model, dimensions, mechanical drawing, mounting pattern, I/O layout, expansion configuration, cooling hardware, and power-connector locations.
For custom server projects, a complete BOM and production-representative sample can make the validation process much more reliable.
Quelle est la manière la plus sûre de préciser la compatibilité E-ATX dans un appel d'offres ?
Short answer: Specify the exact motherboard rather than writing only “E-ATX compatible.”
Include the manufacturer, model number, board revision, dimensions, drawing, standoff locations, PCIe configuration, connector access, and any required service clearances. That converts a vague label into a testable engineering requirement.
Mark Lee - Fondateur et spécialiste des châssis de serveurs (OEM/ODM)
Mark Lee est le fondateur d'ISTONECASE et possède 20 ans d'expérience dans le secteur des châssis de serveurs. Il est spécialisé dans les solutions OEM/ODM pour les châssis GPU et IA, les châssis montés en rack, industriels, muraux, NAS, Mini-ITX et à nœuds multiples. Son expertise permet de mener à bien des projets matériels sur mesure destinés aux centres de données, au calcul IA, au stockage d’entreprise, à l’edge computing, aux réseaux et aux applications industrielles.